The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2013
Filed:
Jun. 30, 2011
Keita Fukutani, Anjo, JP;
Kuniaki Mamitsu, Nukata-gun, JP;
Yasushi Ookura, Okazaki, JP;
Masayoshi Nishihata, Chiryu, JP;
Hiroyuki Wado, Toyota, JP;
Syun Sugiura, Toyota, JP;
Keita Fukutani, Anjo, JP;
Kuniaki Mamitsu, Nukata-gun, JP;
Yasushi Ookura, Okazaki, JP;
Masayoshi Nishihata, Chiryu, JP;
Hiroyuki Wado, Toyota, JP;
Syun Sugiura, Toyota, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
In a semiconductor module, a first heat sink is disposed on a rear surface of a first semiconductor chip constituting an upper arm, and a second heat sink is disposed on a front surface of the first semiconductor chip through a first terminal. A third heat sink is disposed on a rear surface of a second semiconductor chip constituting a lower arm, and a fourth heat sink is disposed on a front surface of the second semiconductor chip through a second terminal. A connecting part for connecting between the upper arm and the lower arm is integral with the first terminal, and is connected to the third heat sink while being inclined relative to the first terminal.