The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2013

Filed:

Apr. 05, 2011
Applicants:

Kuo Kuei Fu, Guishan Township, TW;

Yi Nan Chen, Taipei, TW;

Hsien Wen Liu, Luzhu Township, TW;

Inventors:

Kuo Kuei Fu, Guishan Township, TW;

Yi Nan Chen, Taipei, TW;

Hsien Wen Liu, Luzhu Township, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A monitoring pattern for pattern stitch in double patterning is provided with a plurality of pattern cuts that include at least one line-ended cut and at least one non-line-ended cut, wherein every pattern cut has a stitching critical dimension (CD). A semiconductor wafer having at least one target pattern corresponding to the monitoring pattern is also provided. A method for monitoring pattern stitch can be preformed to check for pattern cut displacement in stitching areas and to increase reliability and printability of layouts, by comparing corresponding stitching critical dimensions of the target pattern and the monitoring pattern.


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