The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8497560 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 30, 2013

Filed:

Feb. 26, 2010
Applicants:

Ming-te Lin, Taipei County, TW;

Ming-yao Lin, Taipei County, TW;

Kuang-yu Tai, Hsinchy, TW;

Inventors:

Ming-Te Lin, Taipei County, TW;

Ming-Yao Lin, Taipei County, TW;

Kuang-Yu Tai, Hsinchy, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2006.01);
U.S. Cl.
CPC ...
Abstract

An LED package is provided. The LED package includes a carrier, an LED chip, a conductive structure, a first encapsulant, a lens and a heat sink. The carrier is cup shaped and comprises a bottom portion and a lateral wall. The LED chip is received in the carrier and disposed on the bottom portion. The conductive structure is electrically connected to the LED chip. The first encapsulant is received in the carrier and fixing the carrier and the conductive structure. The lens is corresponding to the LED chip. The carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier.


Find Patent Forward Citations

Lin, Ming-Te. (2013). Led package and method of assembling the same (U.S. Patent No. 8497560). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8497560

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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