The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2013
Filed:
Sep. 03, 2010
Naoya Ushiyama, Fukuoka-ken, JP;
Kazuhisa Iwashita, Fukuoka-ken, JP;
Tatsuo Tonedachi, Fukuoka-ken, JP;
Teruo Takeuchi, Fukuoka-ken, JP;
Hiroaki Oshio, Fukuoka-ken, JP;
Tetsuro Komatsu, Fukuoka-ken, JP;
Gen Watari, Fukuoka-ken, JP;
Satoshi Shimizu, Fukuoka-ken, JP;
Naoya Ushiyama, Fukuoka-ken, JP;
Kazuhisa Iwashita, Fukuoka-ken, JP;
Tatsuo Tonedachi, Fukuoka-ken, JP;
Teruo Takeuchi, Fukuoka-ken, JP;
Hiroaki Oshio, Fukuoka-ken, JP;
Tetsuro Komatsu, Fukuoka-ken, JP;
Gen Watari, Fukuoka-ken, JP;
Satoshi Shimizu, Fukuoka-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.