The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2013
Filed:
Jun. 18, 2008
Mu-chi Hsu, Taipei Hsien, TW;
Qing Liu, Shenzhen, CN;
Guo-han Yue, Shenzhen, CN;
Chi-lu Chih, Taipei Hsien, TW;
Jun-qi LI, Shenzhen, CN;
Mu-Chi Hsu, Taipei Hsien, TW;
Qing Liu, Shenzhen, CN;
Guo-Han Yue, Shenzhen, CN;
Chi-Lu Chih, Taipei Hsien, TW;
Jun-Qi Li, Shenzhen, CN;
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Abstract
An exemplary brittle non-metallic workpiece () is made by the laser beam (), a cutting surface () of the brittle non-metallic workpiece has no micro cracks. A method for making the brittle non-metallic workpiece includes: focusing a laser beam on the brittle non-metallic substrate to form an elliptic beam spot; driving the laser beam to move along a predetermined curved cutting path, making a center of a major axis of the elliptic beam spot intersecting along the predetermined curved cutting path and the major axis being tangent to the predetermined curved cutting path at the intersecting point; a coolant stream following the elliptic beam spot to move, thus producing a crack in the brittle non-metallic substrate corresponding to the predetermined curved cutting path; separating the brittle non-metallic substrate along the crack. A laser cutting device () for making the same is also provided.