The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2013
Filed:
Jun. 15, 2007
Yasuo Itami, Osaka, JP;
Hisashi Mitsuhashi, Osaka, JP;
Tetsuya Masutani, Osaka, JP;
Peter Cheshire Hupfield, South Glamorgan, GB;
Don Lee Kleyer, Midland, MI (US);
Yasuo Itami, Osaka, JP;
Hisashi Mitsuhashi, Osaka, JP;
Tetsuya Masutani, Osaka, JP;
Peter Cheshire Hupfield, South Glamorgan, GB;
Don Lee Kleyer, Midland, MI (US);
Daikin Industries, Ltd., Osaka, JP;
Dow Corning Ltd., Wales, GB;
Abstract
Disclosed in a mold release composition comprising a fluorosilicone compound of the formula (I): (I) wherein R1, R2, R4, R5, R6, R7, R8 and R9 each is, the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, R3 and R10 each is; the same or different, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group, or Rf—X—, or Z—Y— in which X and Y each is; the same or different, a divalent organic group, Rf is a C1-6 fluoroalkyl group, Z is a silyl group containing a hydrolyzable site, m is 1-100, n is 1-50, and o is 0-200. The mold release composition can give excellent mold releasability and durability of mold releasability (repeated mold releasability).