The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2013

Filed:

May. 20, 2011
Applicant:

Thomas Mayer, Reutlingen, DE;

Inventor:

Thomas Mayer, Reutlingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method is described for manufacturing a micromechanical component. The method includes providing a first substrate, forming a first connecting structure on the first substrate, and forming a microstructure on the first substrate after forming the first connecting structure. The microstructure has at least one movable functional element. The method further includes providing a second substrate having a second connecting structure, and joining the first and second substrates by carrying out a bonding process, the first and second connecting structures being joined to form a common connecting structure, and a sealed cavity being formed in the region of the microstructure. The method provides that the first connecting structure takes the form of a buried connecting structure extending up to an upper surface of the first substrate. Also described is a related micromechanical component.


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