The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2013

Filed:

Apr. 07, 2009
Applicants:

Masahisa Higashi, Kyoto, JP;

Hideki Okamoto, Kyoto, JP;

Eisaku Nakao, Kyoto, JP;

Kazuya Okamoto, Tokyo, JP;

Inventors:

Masahisa Higashi, Kyoto, JP;

Hideki Okamoto, Kyoto, JP;

Eisaku Nakao, Kyoto, JP;

Kazuya Okamoto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/54 (2006.01); B32B 37/00 (2006.01); B32B 38/12 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is an adhesive injection device for injecting an adhesive between the substrates of laminates which each comprise at least two substrates that face each other. The adhesive injection device is provided with: a cassette which holds multiple laminates aligned along the direction of lamination of the substrates; and an adhesive injector which injects adhesive into each inter-substrate space, as the laminates are being held in the cassette, so that the actions of injecting the adhesive into each inter-substrate space overlap chronologically. Holding multiple laminates in the cassette makes it possible to treat the multiple laminates as a unit. By injecting adhesive into each inter-substrate space, as the laminates are being held, so that the actions of injecting the adhesive into each inter-substrate space overlap chronologically, the injection of adhesive into multiple laminates is simplified, and the time required for injection can be reduced.


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