The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Nov. 04, 2009
Kentaro Yoshimura, Hitachi, JP;
Fumio Narisawa, Hitachinaka, JP;
Yuichiro Morita, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention provides a software analyzer supporting development of derived products by allowing efficient selection of software components to be simultaneously reutilized or changed based on the past record of developments and changes of software products. A software analyzer according to the present invention analyzes a plurality of software components included in existing software products and correlations between the plurality of software components. The software analyzer includes product line analysis means adapted to create product line configuration data numerically expressing a set of the plurality of software components included in the existing software products, from existing product configuration data including, for each of the existing software products, data on the plurality of software components and data on the correlations between the plurality of software components, inter-component distance analysis means adapted to calculate inter-software-component distances numerically quantifying the correlations between the software components based on the product line configuration data, component cluster analysis means adapted to group the software components based on the inter-software-component distances, and an output section outputting results obtained by the product line analysis means, the inter-component distance analysis means, and the component cluster analysis means.