The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2013

Filed:

Jan. 27, 2010
Applicants:

Takashi Aso, Kirishima, JP;

Makoto Miyamoto, Okaya, JP;

Inventors:

Takashi Aso, Kirishima, JP;

Makoto Miyamoto, Okaya, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/335 (2006.01);
U.S. Cl.
CPC ...
Abstract

[Problem] There are provided a thermal recording head capable of making proper operation of a converter, and a thermal recording apparatus including the same. [Solution] A thermal recording head () of the invention is driven on a basis of a first control signal and includes a head substrate () including heat generating elements (), a wiring substrate () including, on its surface, a wiring pattern () for transmission of the first control signal, and a mount substrate () disposed facing a back surface of the head substrate () and a back surface of the wiring substrate () and configured to mount the head substrate () and the wiring substrate (). On the surface of the head substrate () is placed a control element () electrically connected to the heat generating elements () and configured to control driving of the heat generating elements (). On the surface of the wiring substrate () is placed a converter () electrically connected to the wiring pattern () and configured to convert the first control signal into a second control signal. The mount substrate () is spaced away from a corresponding region at the back surface of the wiring substrate () that corresponds to a fourth placement area () bearing the converter () on the surface of the wiring substrate ().


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