The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Nov. 22, 2006
Gerhard Lammel, Tuebingen, DE;
Hubert Benzel, Pliezhausen, DE;
Simon Armbruster, Gomaringen, DE;
Christoph Schelling, Stuttgart, DE;
Joerg Brasas, Detmold, DE;
Gerhard Lammel, Tuebingen, DE;
Hubert Benzel, Pliezhausen, DE;
Simon Armbruster, Gomaringen, DE;
Christoph Schelling, Stuttgart, DE;
Joerg Brasas, Detmold, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
The present invention describes a method for producing a micromechanical capacitive pressure transducer and a micromechanical component produced by this method. First, a first electrode is produced in a doped semiconductor substrate. In a further method step, a diaphragm with a second electrode is produced at the surface of the semiconductor substrate. Furthermore, it is provided to apply a first layer, which preferably is made of dielectric material, on the diaphragm and the semiconductor substrate. With the aid of this first layer, the diaphragm and the semiconductor substrate of the finished micromechanical capacitive pressure transducer are mechanically connected to one another directly or indirectly. Furthermore, a buried cavity is produced in the semiconductor substrate between the first and second electrode. In a following etching step, the diaphragm is finally dissolved out of the semiconductor substrate through openings in the first layer, the mechanical connection from the diaphragm to the semiconductor substrate being accomplished with the aid of the first layer. Due to this mechanical connection the diaphragm or the second electrode is able to be movably suspended above the first electrode.