The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Apr. 27, 2007
Gerhard Lammel, Tuebingen, DE;
Hubert Benzel, Pliezhausen, DE;
Matthias Illing, Palo Alto, CA (US);
Franz Laermer, Weil der Stadt, DE;
Silvia Kronmueller, Schwaikheim, DE;
Paul Farber, Stuttgart, DE;
Simon Armbruster, Gomaringen, DE;
Ralf Reichenbach, Esslingen, DE;
Christoph Schelling, Stuttgart, DE;
Ando Feyh, Tamm, DE;
Gerhard Lammel, Tuebingen, DE;
Hubert Benzel, Pliezhausen, DE;
Matthias Illing, Palo Alto, CA (US);
Franz Laermer, Weil der Stadt, DE;
Silvia Kronmueller, Schwaikheim, DE;
Paul Farber, Stuttgart, DE;
Simon Armbruster, Gomaringen, DE;
Ralf Reichenbach, Esslingen, DE;
Christoph Schelling, Stuttgart, DE;
Ando Feyh, Tamm, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A method for producing a silicon substrate, including the steps of providing a silicon substrate having an essentially planar silicon surface, producing a porous silicon surface having a plurality of pores, in particular having macropores and/or mesopores and/or nanopores, applying a filling material that is to be inserted into the silicon, which has a diameter that is less than a diameter of the pores, inserting the filling material into the pores and removing the excess filling material form the silicon surface, if necessary, and tempering the silicon substrate that is furnished with the filling material that has been filled into the pores, at a temperature between ca. 1000° C. and ca. 1400° C., in order to close the generated pores again and to enclose the filling material.