The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2013

Filed:

Aug. 07, 2008
Applicants:

Takeshi Yoshida, Kyoto, JP;

Akira Shigeta, Kyoto, JP;

Yoshiaki Echigo, Kyoto, JP;

Inventors:

Takeshi Yoshida, Kyoto, JP;

Akira Shigeta, Kyoto, JP;

Yoshiaki Echigo, Kyoto, JP;

Assignee:

Unitika Ltd., Amagasaki-Shi, Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/10 (2006.01); C08G 73/00 (2006.01); C08G 6/00 (2006.01); B29D 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object of the present invention, which was made to solve the problems above, is to provide a polyimide precursor resin composition superior in transparency allowing reduction of the residual volatile material rate during molding and giving a polyimide resin composition (e.g., polyimide film) superior in mechanical properties and transparency even when a cheaper polyamide-imide is used. The present invention relates to a polyimide precursor resin composition, comprising a polyamide-imide (A) containing a diamine monomer unit represented by the following formula (1) and a polyamic acid (B) containing at least one kind of monomer unit selected tetracarboxylic acid monomer units represented by the following formulae (2p) to (2r), wherein the haze of the film having a thickness of 40 μm obtained by imidation of the polyimide precursor resin composition is 4% or less: (wherein, R represents an alkylene group having 1 to 5 carbon atoms);


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