The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Apr. 12, 2011
Yuichi Urano, Matsumoto, JP;
Yuichi Urano, Matsumoto, JP;
Fuji Electric Co., Ltd., , JP;
Abstract
A method of manufacturing a semiconductor apparatus includes forming back surface electrodeon back surface of semiconductor wafer, that bends convexly toward the front surface side due to back surface electrodebeing formed; treating the back surface with a plasma for removing the deposits on the back surface; sticking removable adhesive tapeto the back surface along the warp thereof for maintaining the bending state of semiconductor waferafter the step of sticking; electrolessly plating to form filmon the front surface of semiconductor wafer; peeling off removable adhesive tape; cutting out semiconductor chips; and mounting the semiconductor chip by bonding with a solder for manufacturing a semiconductor apparatus. The manufacturing method prevents external appearance anomalies from occurring on the back surface electrode, improves the reliability, and allows manufacture of the semiconductor apparatuses with a high throughput of non-defective products.