The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Jan. 19, 2011
Applicants:
Eunchul Ahn, Yongin-Si, KR;
Yun-rae Cho, Seoul, KR;
Taesung Yoon, Cheonan-Si, KR;
Youngmin Lee, Asan-Si, KR;
Inventors:
Eunchul Ahn, Yongin-Si, KR;
Yun-Rae Cho, Seoul, KR;
TaeSung Yoon, Cheonan-Si, KR;
Youngmin Lee, Asan-Si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided is an apparatus for manufacturing a bonding structure, a bonding structure, and a method of fabricating the same. The bonding structure includes a pad including an upper surface with a first area, a ball adhered to the upper surface of the pad, and a wire extending from the ball. An adhesion surface of the ball adhered to the pad may have substantially the same shape as that of the upper surface of the pad.