The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2013

Filed:

Aug. 24, 2010
Applicants:

Chung-chih Feng, Kaohsiung, TW;

I-peng Yao, Kaohsiung, TW;

Yung-chang Hung, Kaohsiung, TW;

Lyang-gung Wang, Kaohsiung, TW;

Wen-chieh Wu, Kaohsiung, TW;

Inventors:

Chung-Chih Feng, Kaohsiung, TW;

I-Peng Yao, Kaohsiung, TW;

Yung-Chang Hung, Kaohsiung, TW;

Lyang-Gung Wang, Kaohsiung, TW;

Wen-Chieh Wu, Kaohsiung, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/32 (2006.01); B24B 37/22 (2012.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.


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