The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Mar. 07, 2011
Andrew L. Mcnees, Lexington, KY (US);
David L. Bernard, Lexington, KY (US);
Paul W. Dryer, Lexington, KY (US);
Sean T. Weaver, Union, KY (US);
Eric S. Hall, Lexington, KY (US);
Andrew L. McNees, Lexington, KY (US);
David L. Bernard, Lexington, KY (US);
Paul W. Dryer, Lexington, KY (US);
Sean T. Weaver, Union, KY (US);
Eric S. Hall, Lexington, KY (US);
Funai Electric Co., Ltd., , JP;
Abstract
Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles for fluid ejection. Further, the fluid ejection device includes a substrate disposed below the nozzle plate. The substrate includes a top surface adapted to adhere to the nozzle plate. The substrate also includes at least one fluid via configured within the substrate for providing fluid to the plurality of nozzles of the nozzle plate. Furthermore, the fluid ejection device includes at least one supporting structure configured within each fluid via of the at least one fluid via. The at least one supporting structure is further configured at a predetermined depth from the top surface of the substrate to regulate the flow of the fluid from the at least one fluid via to the plurality of nozzles. Further, disclosed is a method to fabricate the fluid ejection device.