The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2013

Filed:

Jan. 04, 2011
Applicants:

Chen-yong Cher, Port Chester, NY (US);

Wilfried E. Haensch, Somers, NY (US);

Eren Kursun, Ossining, NY (US);

David R. Motschman, Rochester, MN (US);

Inventors:

Chen-Yong Cher, Port Chester, NY (US);

Wilfried E. Haensch, Somers, NY (US);

Eren Kursun, Ossining, NY (US);

David R. Motschman, Rochester, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2011.01);
U.S. Cl.
CPC ...
Abstract

A mechanism is provided for minimizing reliability problems in a three-dimensional (3D) integrated circuit. A set of sensors are interrogated for current data. A direction of force and a magnitude of the force are determined based on the current data for each sensor in the set of sensors for each of one or more directions between the sensor and at least one neighboring sensor thereby forming a set of forces. Each of the set of forces is used to identify one or more points of stress that are at or above the predetermined force threshold. Responsive to identifying at least one point of stress that is at or above the predetermined force threshold, one or more temperature actuation actions are initiated in order to reduce at least one point of stress in the region where the at least one point of stress is identified.


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