The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2013

Filed:

Nov. 20, 2007
Applicant:

Michael G. Lee, San Jose, CA (US);

Inventor:

Michael G. Lee, San Jose, CA (US);

Assignee:

Fujitsu Limited, Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/488 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor assembly is provided that includes a substrate. A first set of non-conductive hedges is disposed on and protrudes from a first surface of the substrate. A chip is coupled to and spaced apart from the substrate. The chip has a second surface facing the first surface of the substrate. A second set of non-conductive hedges is disposed on and protrudes from the second surface of the chip. The first set of hedges is configured and positioned to engage the second set of hedges to restrict movement of the substrate with respect to the chip. The second set of hedges is configured and positioned to engage the first set of hedges to restrict movement of the chip with respect to the substrate.


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