The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8487191 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 16, 2013

Filed:

Dec. 22, 2009
Applicants:

Nobuhito Makino, Ibaraki, JP;

Hajime Inazumi, Ibaraki, JP;

Taku Yoshida, Ibaraki, JP;

Inventors:

Nobuhito Makino, Ibaraki, JP;

Hajime Inazumi, Ibaraki, JP;

Taku Yoshida, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); B32B 15/08 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01);
Abstract

An adhesive-free flexible laminate formed from a polyimide film in which at least one surface has been plasma treated, a tie-coat layer formed on the surface of the plasma-treated polyimide film, a metal seed layer made of either copper or copper alloy and which is formed on the tie-coat layer, and a metal conductive layer made of either copper or copper alloy and which is formed on the metal seed layer, wherein the atomic percent of Cu inclusion in the tie-coat layer is 0.5 at % or less. Consequently, provided is a flexible laminate capable of effectively inhibiting the deterioration of the peel strength upon producing a flexible laminate (in particular a two-layer metalizing laminate).


Find Patent Forward Citations

Makino, Nobuhito. (2013). Flexible laminate and flexible electronic circuit board formed by using the same (U.S. Patent No. 8487191). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8487191

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