The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2013
Filed:
Jul. 13, 2010
Dong Pyo Kim, Gyeonggi-do, KR;
Kyu Ha Baek, Daejeon, KR;
Kun Sik Park, Daejeon, KR;
Lee MI DO, Daejeon, KR;
Dong Pyo Kim, Gyeonggi-do, KR;
Kyu Ha Baek, Daejeon, KR;
Kun Sik Park, Daejeon, KR;
Lee Mi Do, Daejeon, KR;
Electronics and Telecommunications Research Institute, Daejeon, KR;
Abstract
A via forming method that includes forming via-holes in a substrate is provided. The method includes putting the substrate, having the via-holes, in a first solution to fill the via-holes with the first solution. Metal particles are sunk into the via-holes by supplying a second solution containing the metal particles to the first solution. A first curing process of heat-treating the substrate is performed so as to form vias in the via-holes. A multi-chip package that includes the substrate having the vias is also provided.