The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2013
Filed:
Dec. 07, 2011
Vincent Jarry, La Membrolle sur Choisille, FR;
Marc Feron, Paris, FR;
Vincent Jarry, La Membrolle sur Choisille, FR;
Marc Feron, Paris, FR;
STMicroelectronics (Tours) SAS, Tours, FR;
Abstract
A method for thinning and dicing a wafer of electronic circuits, wherein: a thinning step is carried out while the wafer is supported by a first film bonded at the periphery of a support frame; and a dicing step is carried out while the thinned wafer is supported by a second film bonded at the periphery of the same frame from the other surface of the wafer, the first film being unstuck only once the second one is in place.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile