The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2013

Filed:

Jun. 30, 2009
Applicants:

Junko Sato, Niigata, JP;

Osamu Nakayama, Niigata, JP;

Takashi Fukumoto, Niigata, JP;

Inventors:

Junko Sato, Niigata, JP;

Osamu Nakayama, Niigata, JP;

Takashi Fukumoto, Niigata, JP;

Assignee:

Kuraray Co., Ltd., Kurashiki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/039 (2006.01); C07D 327/04 (2006.01); C07D 497/08 (2006.01); C08F 20/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

An acrylate derivative represented by the following general formula (1): (in the formula, Rrepresents a hydrogen atom, a methyl group or a trifluoromethyl group; each of R, R, R, R, R, Rand Rindependently represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkoxy group; each of Rand Rindependently represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkoxy group, or Rand Rare bonded to each other to represent an alkylene group, —O— or —S—; n represents 0, 1 or 2; and W represents an alkylene group or a cycloalkylene group); an intermediate thereof; a method for producing the same; a polymer compound which is obtainable from polymerization of a raw material containing the foregoing acrylate derivative and which is excellent in solubility in an organic solvent used for the preparation of a photoresist composition; and a photoresist composition containing the polymer compound, an organic solvent and a photo acid generator and having excellent adhesion to substrate and less pattern collapse, are provided.


Find Patent Forward Citations

Loading…