The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2013

Filed:

Jul. 16, 2007
Applicants:

Kei Takahashi, Kawasaki, JP;

Fumio Asada, Kawasaki, JP;

Haruo Ikeda, Kawasaki, JP;

Osamu Miyachi, Kawasaki, JP;

Inventors:

Kei Takahashi, Kawasaki, JP;

Fumio Asada, Kawasaki, JP;

Haruo Ikeda, Kawasaki, JP;

Osamu Miyachi, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/04 (2006.01); C08L 51/00 (2006.01); C08L 23/26 (2006.01); B65D 1/00 (2006.01); C09J 123/04 (2006.01); C09J 123/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A welding material, comprising a modified polyethylene resin composition (Z) comprising from 0.5 to 95 wt % of a modified polyethylene resin (X) having at least one monomer selected from the group consisting of an unsaturated carboxylic acid and its derivative, grafted to a polyethylene resin (A) having a density of from 0.910 to 0.965 g/cmand a MFR (temperature: 190° C., load: 2.16 kg) of from 0.1 to 5.0 g/10 min, and from 5 to 99.5 wt % of an unmodified polyethylene resin (Y) having a density of from 0.930 to 0.965 g/cm, a MFR of from 0.01 to 5.0 g/10 min and a melt flow rate ratio (HL-MFR (temperature: 190° C., load: 21.6 kg)/MFR of from 40 to 270, and having a density of from 0.938 to 0.965 g/cmand a MFR of from 0.05 to 1.0 g/10 min.


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