The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2013
Filed:
Nov. 14, 2011
Shunsuke Takeuchi, Echizen, JP;
Kenichi Kawasaki, Echizen, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Toshiyuki Iwanaga, Sabae, JP;
Shunsuke Takeuchi, Echizen, JP;
Kenichi Kawasaki, Echizen, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Toshiyuki Iwanaga, Sabae, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A method for manufacturing a laminated electronic component including an electronic component main body including laminated functional layers, internal conductors which are disposed inside the electronic component main body and a portion of which are exposed portions exposed at outer surfaces of the electronic component main body, and external terminal electrodes disposed on the outer surfaces of the electronic component main body so as to connect to the internal conductors and cover the exposed portions of the internal conductors includes the step of forming a substrate plating film having an average particle diameter of metal particles of at least about 1.0 μm on the outer surface of the electronic component main body through direct plating so as to cover the exposed portions of the internal conductors in the formation of the external terminal electrodes on the electronic component main body.