The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2013

Filed:

Dec. 07, 2009
Applicants:

Ryo Kuwabara, Osaka, JP;

Koso Matsuno, Osaka, JP;

Atsushi Yamaguchi, Osaka, JP;

Hidenori Miyakawa, Osaka, JP;

Inventors:

Ryo Kuwabara, Osaka, JP;

Koso Matsuno, Osaka, JP;

Atsushi Yamaguchi, Osaka, JP;

Hidenori Miyakawa, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/12 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01);
Abstract

A package structure includes a first printed wiring board having mounted on a top surface a plurality of electronic components including at least one first electronic component, a second printed wiring board stacked on the top surface side of the first printed wiring board, and a plurality of connecting members for mechanically connecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding a top surface of the at least one first electronic component to a bottom surface of the second printed wiring board.


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