The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8482713 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 09, 2013

Filed:

Feb. 04, 2011
Applicants:

Jun Qi, Cupertino, CA (US);

Wayne H. Fu, Mountain View, CA (US);

Chenhui Wang, Cupertino, CA (US);

Kuanying Lin, Mountain View, CA (US);

Nathan K. Gupta, San Francisco, CA (US);

Victor H. Yin, Cupertino, CA (US);

Inventors:

Jun Qi, Cupertino, CA (US);

Wayne H. Fu, Mountain View, CA (US);

Chenhui Wang, Cupertino, CA (US);

Kuanying Lin, Mountain View, CA (US);

Nathan K. Gupta, San Francisco, CA (US);

Victor H. Yin, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/13 (2006.01); G02F 1/1335 (2006.01); B32B 38/04 (2006.01); B23K 26/38 (2006.01); B23K 26/00 (2006.01); B29D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Electronic devices may be provided with display structures such as glass and polymer layers in a liquid crystal display. The glass layers may serve as substrates for components such as a color filter layer and thin-film transistor layer. The polymer layers may include films such as a polarizer film and other optical films. During fabrication of a display, the polymer layers and glass layers may be laminated to one another. Portions of the polymer layers may extend past the edges of the glass layers. Laser cutting techniques may be used to trim away excess portions of the polymer layer that do not overlap underlying portions of the glass layers. Laser cutting may involve application of an adjustable infrared laser beam.


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