The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2013
Filed:
Jul. 22, 2011
Jun-young Ko, Cheonan-si, KR;
Jae-yong Park, Cheonan-si, KR;
Jun-young Ko, Cheonan-si, KR;
Jae-yong Park, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package is provided. The semiconductor package includes a package substrate, a plurality of semiconductor chips, and a plurality of connection terminals. The package substrate includes a center portion, which has a first recess with a portion of a top of the package substrate removed, and an edge portion that has a plurality of second recesses. Each second recess has a portion of a bottom of the package substrate removed. The plurality of semiconductor chips are mounted in the first recess, and the plurality of connection terminals are respectively disposed in the second recesses.