The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2013
Filed:
Nov. 26, 2009
Jorg Horzel, Heverlee, BE;
Gunnar Schubert, Constance, DE;
Stefan Dauwe, Blankenbach, DE;
Peter Roth, Hanau, DE;
Tobias Droste, Darmstadt, DE;
Wilfried Schmidt, Schwaigern, DE;
Ingrid Ernst, Kahl, DE;
Jorg Horzel, Heverlee, BE;
Gunnar Schubert, Constance, DE;
Stefan Dauwe, Blankenbach, DE;
Peter Roth, Hanau, DE;
Tobias Droste, Darmstadt, DE;
Wilfried Schmidt, Schwaigern, DE;
Ingrid Ernst, Kahl, DE;
SHOTT Solar AG, Mainz, DE;
Abstract
A method for producing an electrically conducting metal contact on a semiconductor component having a coating on the surface of a semiconductor substrate. In order to keep transfer resistances low while maintaining good mechanical strength, the invention proposes applying a particle-containing fluid onto the coating, where the particles contain at least metal particles and glass frits, curing the fluid while simultaneously forming metal areas in the substrate through heat treatment, removing the cured fluid and the areas of the coating covered by the fluid, and depositing, for the purposes of forming the contact without using intermediate layers, electrically conducting material from a solution onto areas of the semiconductor component in which the coating is removed while at the same time conductively connecting the metal areas present in said areas on the substrate.