The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2013

Filed:

May. 19, 2009
Applicants:

Greja J. A. M. Verhelijden, Riethoven, NL;

Philippe Meunier-beillard, Kortenberg, BE;

Johannes J. T. M. Donkers, Kortenberg, BE;

Inventors:

Greja J. A. M. Verhelijden, Riethoven, NL;

Philippe Meunier-Beillard, Kortenberg, BE;

Johannes J. T. M. Donkers, Kortenberg, BE;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a MEMS device comprises forming a MEMS device element (). A sacrificial layer () is provided over the device element and a package cover layer () is provided over the sacrificial layer. The sacrificial layer is removed using at least one opening () in the cover layer and the at least one opening () is sealed by an anneal process.


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