The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2013

Filed:

Dec. 26, 2006
Applicants:

Jin Wuk Kim, Gyeonggi-do, KR;

Yeon Heui Nam, Gangwon-do, KR;

Inventors:

Jin Wuk Kim, Gyeonggi-do, KR;

Yeon Heui Nam, Gangwon-do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabricating a mold includes the steps of forming a photo-polymerizable resin layer between a master substrate and a transparent mold substrate, wherein a first pattern is formed on the master substrate; solidifying the resin layer by exposing the resin layer to a UV light through the transparent mold substrate; and forming a mold having a second pattern by separating the resin layer from the master substrate, wherein the second pattern is in a form of a recess on the resin layer at a portion corresponding to the first pattern and the resin layer being engaged with the mold substrate.


Find Patent Forward Citations

Kim, Jin. (2013). Method of fabricating a mold (U.S. Patent No. 8480936). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8480936

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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