The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2013
Filed:
Nov. 19, 2010
Yu-ching Liu, Taipei Hsien, TW;
Chi-an Yu, Taipei Hsien, TW;
Xi-hang LI, Shenzhen, CN;
Bing Liu, Shenzhen, CN;
BO Xu, Shenzhen, CN;
Jie-peng Kang, Shenzhen, CN;
Yu-Ching Liu, Taipei Hsien, TW;
Chi-An Yu, Taipei Hsien, TW;
Xi-Hang Li, Shenzhen, CN;
Bing Liu, Shenzhen, CN;
Bo Xu, Shenzhen, CN;
Jie-Peng Kang, Shenzhen, CN;
Fu Tai Hua Industry ( Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Abstract
A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conductive base is located above the cooling surface of the cooling sheet, and configured to support electronic components on a printed circuit board and transfer heat between the electronic components and the cooling surface. When the cooling sheet is powered on, the cooling surface is in a constant state of low temperature. Due to the heat transfer between the cooling surface and the thermal conductive base, heat from the electronic components can be transferred from the thermal conductive base to the cooling surface continuously.