The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2013

Filed:

Mar. 04, 2010
Applicants:

Toshiyuki Yoshizawa, Tokyo, JP;

Akira Furuya, Tokyo, JP;

Masaomi Ishikura, Tokyo, JP;

Keisuke Takasugi, Tokyo, JP;

Hiroshi Take, Tokyo, JP;

Inventors:

Toshiyuki Yoshizawa, Tokyo, JP;

Akira Furuya, Tokyo, JP;

Masaomi Ishikura, Tokyo, JP;

Keisuke Takasugi, Tokyo, JP;

Hiroshi Take, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/00 (2006.01); H01G 4/005 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a thin film capacitor having a device structure for suppressing peeling between an insulating film and a substrate. A thin film capacitorhas a laminate structure that is formed by laminating a lower electrode, a dielectric film, and an upper electrodein sequence on a substrate. An adhesion layeris formed on a side surface of the lower electrodevia the dielectric film, and an insulating filmin contact with the adhesion layercovers the laminate structure. According to this device structure, the adhesion layerhaving excellent adhesiveness to the insulating filmis disposed between the insulating filmand the dielectric film, so that peeling of the insulating filmcan be suppressed.


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