The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2013
Filed:
Sep. 21, 2011
Naotaka Kuroda, Tokyo, JP;
Akio Wakejima, Tokyo, JP;
Masahiro Tanomura, Tokyo, JP;
Hironobu Miyamoto, Tokyo, JP;
Naotaka Kuroda, Tokyo, JP;
Akio Wakejima, Tokyo, JP;
Masahiro Tanomura, Tokyo, JP;
Hironobu Miyamoto, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor element having a rectangular two-dimensional geometry and serving as a heat source, a first heat sink section including the semiconductor element mounted thereon, and a second heat sink section joined to an opposite side of the first heat sink section that includes the semiconductor element. A relation among directional components of thermal conductivity is K≧K>K, where directional components of a three-dimensional thermal conductivity of the heat sink section in X, Y, and Z directions are determined as Kxx, Kyy, and Kzz. A relation among directional components of a thermal conductivity of the second heat sink section is K≧K>Kor K≧K>K, where the directional components of the thermal conductivity of the second heat sink section in X, Y, and X directions are determined as K, K, and K