The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2013
Filed:
Apr. 28, 2011
Kyu Won Lee, Seoul, KR;
Cheol Ho Joh, Seoul, KR;
Eun-hye DO, Suwon-si, KR;
Ji Eun Kim, Suwon-si, KR;
Hee Min Shin, Cheongju-si, KR;
Kyu Won Lee, Seoul, KR;
Cheol Ho Joh, Seoul, KR;
Eun-Hye Do, Suwon-si, KR;
Ji Eun Kim, Suwon-si, KR;
Hee Min Shin, Cheongju-si, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads.