The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2013

Filed:

Dec. 10, 2009
Applicants:

Fifin Sweeney, San Diego, CA (US);

Jason R. Gonzalez, San Diego, CA (US);

Inventors:

Fifin Sweeney, San Diego, CA (US);

Jason R. Gonzalez, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/98 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

A package includes a printed circuit board (PCB) having a first side and a second side and a thickness between the first side and the second side and a stacked die including a top die mounted on a bottom die, the bottom die being at least partially embedded in the PCB. Also a method of forming a package that includes forming an opening in a top surface of the PCB layer, placing a stacked die including a top die stacked on a bottom die into the opening, laminating the PCB layer to form a laminate layer, and forming an electrical connection with the stacked die.


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