The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2013
Filed:
May. 31, 2011
Eiji Hayashishita, Nagoya, JP;
Yoshihisa Saimoto, Sagamihara, JP;
Makoto Kataoka, Nagoya, JP;
Katsutoshi Ozaki, Nagoya, JP;
Mitsuru Sakai, Kisarazu, JP;
Eiji Hayashishita, Nagoya, JP;
Yoshihisa Saimoto, Sagamihara, JP;
Makoto Kataoka, Nagoya, JP;
Katsutoshi Ozaki, Nagoya, JP;
Mitsuru Sakai, Kisarazu, JP;
Mitsui Chemicals Tohcello, Inc., Minato-Ku, Tokyo, JP;
Abstract
To provide a semiconductor wafer surface protection sheet having good adhesion to irregularities on a patterned surface of a semiconductor wafer and having good peelability after wafer grinding. Specifically, a semiconductor wafer surface protection sheet is provided that includes a base layer having a tensile elasticity at 25° C., E(25), of 1 GPa or more; a resin layer A that satisfies the condition E(60)/E(25)<0.1, where E(25) is a tensile elasticity at 25° C. and E(60) is a tensile elasticity at 60° C., the E(60) ranging from 0.005 MPa to 1 MPa; and a resin layer B having a tensile elasticity at 60° C., E(60), of 1 MPa or more and having a thickness of 0.1 μm to less than 100 μm, the E(60) being larger than the E(60) of the resin layer A.