The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2013

Filed:

Jun. 22, 2009
Applicants:

Lawrence A. Clevenger, Hopewell Junction, NY (US);

Zhengwen LI, Hopewell Junction, NY (US);

Kevin S. Petrarca, Hopewell Junction, NY (US);

Roger A. Quon, Hopewell Junction, NY (US);

Carl J. Radens, Hopewell Junction, NY (US);

Brian C. Sapp, Hopewell Junction, NY (US);

Inventors:

Lawrence A. Clevenger, Hopewell Junction, NY (US);

Zhengwen Li, Hopewell Junction, NY (US);

Kevin S. Petrarca, Hopewell Junction, NY (US);

Roger A. Quon, Hopewell Junction, NY (US);

Carl J. Radens, Hopewell Junction, NY (US);

Brian C. Sapp, Hopewell Junction, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 5/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A contiguous deep trench includes a first trench portion having a constant width between a pair of first parallel sidewalls, second and third trench portions each having a greater width than the first trench portion and laterally connected to the first trench portion. A non-conformal deposition process is employed to form a conductive layer that has a tapered geometry within the contiguous deep trench portion such that the conductive layer is not present on bottom surfaces of the contiguous deep trench. A gap fill layer is formed to plug the space in the first trench portion. The conductive layer is patterned into two conductive plates each having a tapered vertical portion within the first trench portion. After removing remaining portions of the gap fill layer, a device is formed that has a small separation distance between the tapered vertical portions of the conductive plates.


Find Patent Forward Citations

Loading…