The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2013

Filed:

Apr. 24, 2007
Applicants:

Natalie A. Merrill, Somerville, NJ (US);

Thomas Quinn, St. Paul, MN (US);

Michael Jablon, Ramsey, NJ (US);

Inventors:

Natalie A. Merrill, Somerville, NJ (US);

Thomas Quinn, St. Paul, MN (US);

Michael Jablon, Ramsey, NJ (US);

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 37/00 (2006.01); B32B 27/00 (2006.01); B01F 17/00 (2006.01); C08L 23/00 (2006.01); C08L 23/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Hot melt adhesive compositions which have enhanced adhesion to difficult substrates, particularly at refrigerator/freezer temperatures or at elevated temperatures. The inventive compositions require a base polymer comprising at least one metallocene ethylene-containing polymer or at least one non-metallocene, amorphous, propylene containing polymer; a tackifier; an optional wax; and an adhesion promoting additive comprising at least one semi-crystalline polymer having a weight average molecular weight of about 30,000 daltons or less. It has been found that the adhesion promoting additive of this invention enhances the adhesion properties of a hot melt adhesive composition having a metallocene ethylene-containing base polymer or non-metallocene, amorphous, propylene containing base polymer, particularly at elevated temperatures or at low refrigerator and freezer temperatures where other conventional adhesives have been unsuccessful.


Find Patent Forward Citations

Loading…