The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2013
Filed:
Jul. 26, 2010
Prasad Yalamanchili, Santa Clara, CA (US);
Xiangdong Qiu, Cupertino, CA (US);
Reddy Raju, Fremont, CA (US);
Jay A. Skidmore, San Jose, CA (US);
Michael AU, Fremont, CA (US);
Laura Zavala, Mountain view, CA (US);
Richard L. Duesterberg, Mountain View, CA (US);
Prasad Yalamanchili, Santa Clara, CA (US);
Xiangdong Qiu, Cupertino, CA (US);
Reddy Raju, Fremont, CA (US);
Jay A. Skidmore, San Jose, CA (US);
Michael Au, Fremont, CA (US);
Laura Zavala, Mountain view, CA (US);
Richard L. Duesterberg, Mountain View, CA (US);
JDS Uniphase Corporation, Milpitas, CA (US);
Abstract
A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.