The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2013
Filed:
Jul. 16, 2009
Ki-hyun Kim, Suwon-si, KR;
SE Ho Park, Suwon-Si, KR;
Seok-myong Kang, Hwaseong-si, KR;
Young-min Lee, Yongin-si, KR;
Ki-Hyun Kim, Suwon-si, KR;
Se Ho Park, Suwon-Si, KR;
Seok-Myong Kang, Hwaseong-si, KR;
Young-Min Lee, Yongin-si, KR;
Samsung Electronics Co., Ltd, , KR;
Abstract
A method for fabricating a printed circuit board is provided. The method includes manufacturing a base film including a first side and a second side opposite to the first side; printing a first wiring on the first side with a high-viscosity conductive material having a viscosity of 5,000 to 300,000 centipoise (CPS); forming a via-hole that passes through both sides of the base film, and passes by the first wiring; and printing a second wiring on the second side with a low-viscosity conductive material having a viscosity of 100 to 5,000 CPS. The low-viscosity conductive material is applied to an inner wall of the via-hole to conductively connect the first wiring to the second wiring.