The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Aug. 11, 2010
Shinji Higashibata, Chiyoda-ku, JP;
Shozo Kanzaki, Chiyoda-ku, JP;
Hiroyoshi Nishizaki, Chiyoda-ku, JP;
Fumiaki Arimai, Chiyoda-ku, JP;
Mikihiko Suzuki, Chiyoda-ku, JP;
Shinji Higashibata, Chiyoda-ku, JP;
Shozo Kanzaki, Chiyoda-ku, JP;
Hiroyoshi Nishizaki, Chiyoda-ku, JP;
Fumiaki Arimai, Chiyoda-ku, JP;
Mikihiko Suzuki, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Provided is a small and low-cost resin-sealed electronic control device including a first electronic board and a second electronic board respectively bonded onto an upper surface and a lower surface of a support plate, each of the first electronic board and the second electronic board having an increased mounting area on which circuit components are mounted. A first electronic board (A) and a second electronic board (A) respectively bonded onto an upper surface and a lower surface of a support plate (A) include outer circuit components () and inner circuit components () respectively mounted on outer surfaces and inner surfaces thereof. The inner circuit components () are fitted into a window hole portion () of the support plate (A) and are sealed with a filler ().