The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Mar. 16, 2011
Jian-hong Zeng, Taoyuan Hsien, TW;
Shou-yu Hong, Taoyuan Hsien, TW;
Qi-feng YE, Taoyuan Hsien, TW;
Yi-cheng Lin, Taoyuan Hsien, TW;
Jian-Hong Zeng, Taoyuan Hsien, TW;
Shou-Yu Hong, Taoyuan Hsien, TW;
Qi-Feng Ye, Taoyuan Hsien, TW;
Yi-Cheng Lin, Taoyuan Hsien, TW;
Delta Electronics, Inc., Taoyuan Hsien, TW;
Abstract
A power module includes a first heat sink, first and second power chips, a thermo-conductive insulating layer, a lead frame and a molding compound. The first heat sink has a first area and a second area. The first power chip is disposed in the first area. The thermo-conductive insulating layer is disposed in the second area. The second power chip is disposed on the heat sink through the thermo-conductive insulating layer. The lead frame is electrically connected to at least one of the first and second power chips. The molding compound covers the first and second power chips, the thermo-conductive insulating layer and a portion of the lead frame. The first heat sink is electrically connected to at least one of the first and second power chips. Because the first power chip is not disposed on the first heat sink through the thermo-conductive insulating layer, the cost can be reduced.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile