The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Feb. 17, 2010
Keisuke Horiuchi, Hitachinaka, JP;
Atsuo Nishihara, Kashiwa, JP;
Hiroshi Hozoji, Hitachiota, JP;
Michiaki Hiyoshi, Yokohama, JP;
Takehide Yokozuka, Yokohama, JP;
Keisuke Horiuchi, Hitachinaka, JP;
Atsuo Nishihara, Kashiwa, JP;
Hiroshi Hozoji, Hitachiota, JP;
Michiaki Hiyoshi, Yokohama, JP;
Takehide Yokozuka, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor power module includes an insulated substrate with a plurality of power semiconductor devices mounted thereon and a heat sink for radiating heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the insulated substrate is bonded by metallic bonding to another surface of the base of the heat sink opposite the one surface of the base of the heat sink on which the radiation fins are formed.