The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8472142 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 25, 2013

Filed:

Sep. 20, 2007
Applicants:

Minggao Yao, Dong Guan, CN;

Yiru Xie, Dong Guan, CN;

Inventors:

MingGao Yao, Dong Guan, CN;

YiRu Xie, Dong Guan, CN;

Assignee:

SAE Magnetics (H.K.) Ltd., Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/60 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present bonded structure uses metal ball to bond or weld the respective bonding surfaces of electrical pads which are arranged to face the same direction. The structure can be controlled visually and thus enables a high connection quality of no short circuit. In addition, the bonding operation of the bonded structure is carried out without using pressure, thus it will not damage surroundings of the electrical components. Accordingly, the manufacture yield is significantly improved and the cost is prominently reduced. The present invention also discloses a bonding method and a head gimbal assembly and a head stack assembly and a drive unit using the bonded structure.


Find Patent Forward Citations

Yao, MingGao. (2013). Method of making a bonded structure for an electrical component, and/or head gimbal assembly, head stack assembly, and disk drive unit incorporating the same (U.S. Patent No. 8472142). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8472142

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