The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Jun. 03, 2011
Masanori Minamio, Osaka, JP;
Shinichi Ijima, Osaka, JP;
Masanori Minamio, Osaka, JP;
Shinichi Ijima, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A resin-sealed semiconductor device includes a power element (), a control element (), a first lead frame () having a first die pad (A) which holds the power element (), a second lead frame () having a second die pad (A) which holds the control element (), and a housing () made of a resin material and sealing the power element, the first die pad, the control element, and the second die pad. A lower surface of the second die pad is higher than an upper surface of the first element, and at least part of the first die pad and at least part of the second die pad overlap each other when viewed from the top. One of the first leads and one of the second leads are directly joined together by a joint portion () and electrically coupled together in the housing.