The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2013

Filed:

Aug. 23, 2010
Applicants:

Jung Ho JO, Daejeon, KR;

Kyung Jun Kim, Daejeon, KR;

Hye Ran Seong, Daejeon, KR;

Hye Won Jeong, Daejeon, KR;

Chan Hyo Park, Daejeon, KR;

Yu NA Kim, Daejeon, KR;

Sang Woo Kim, Daejeon, KR;

SE Jin Shin, Daejeon, KR;

Kyoung Ho Ahn, Daejeon, KR;

Inventors:

Jung Ho Jo, Daejeon, KR;

Kyung Jun Kim, Daejeon, KR;

Hye Ran Seong, Daejeon, KR;

Hye Won Jeong, Daejeon, KR;

Chan Hyo Park, Daejeon, KR;

Yu Na Kim, Daejeon, KR;

Sang Woo Kim, Daejeon, KR;

Se Jin Shin, Daejeon, KR;

Kyoung Ho Ahn, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08G 69/26 (2006.01); C08K 5/41 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to polyimide or precursor thereof represented by Chemical Formula 1 or 2 and a photosensitive resin composition including the same. The polyimide or precursor thereof are fabricated using diamine comprising polyalkyleneoxide. The photosensitive resin composition of the present invention has excellent light transmissivity, an excellent resolution, and excellent photo sensitivity and image forming performance. Further, the photosensitive resin composition has high adhesiveness with substrates, such as a silicon film, a silicon oxide film, and a metal film. In particular, an excellent film without failure, such as crack, can be formed.


Find Patent Forward Citations

Loading…