The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8470699 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 25, 2013

Filed:

Nov. 09, 2009
Applicant:

Kenji Suzuki, Narita, JP;

Inventor:

Kenji Suzuki, Narita, JP;

Assignee:

Showa Denko K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a method of manufacturing a silicon carbide semiconductor apparatus which provides a smooth silicon carbide surface while maintaining a high impurity activation ratio. The method of manufacturing a silicon carbide semiconductor apparatus which forms an impurity region in the surface layer of a silicon carbide substrate includes the steps of implanting an impurity into the surface layer of the silicon carbide substrate, forming a carbon film on the surface of the silicon carbide substrate, preliminarily heating the silicon carbide substrate with the carbon film as a protective film, and thermally activating the silicon carbide substrate with the carbon film as a protective film.


Find Patent Forward Citations

Suzuki, Kenji. (2013). Method of manufacturing silicon carbide semiconductor apparatus (U.S. Patent No. 8470699). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8470699

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