The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Mar. 19, 2010
Torsten Kramer, Wannweil, DE;
Kathrin Knese, Reutlingen, DE;
Hubert Benzel, Pliezhausen, DE;
Karl-heinz Kraft, Herrenberg, DE;
Simon Armbruster, Wannweil, DE;
Torsten Kramer, Wannweil, DE;
Kathrin Knese, Reutlingen, DE;
Hubert Benzel, Pliezhausen, DE;
Karl-Heinz Kraft, Herrenberg, DE;
Simon Armbruster, Wannweil, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A simple and economical method for manufacturing very thin capped MEMS components. In the method, a large number of MEMS units are produced on a component wafer. A capping wafer is then mounted on the component wafer, so that each MEMS unit is provided with a capping structure. Finally, the MEMS units capped in this way are separated to form MEMS components. A diaphragm layer is formed in a surface of the capping wafer by using a surface micromechanical method to produce at least one cavern underneath the diaphragm layer, support points being formed that connect the diaphragm layer to the substrate underneath the cavern. The capping wafer structured in this way is mounted on the component wafer in flip chip technology, so that the MEMS units of the component wafer are capped by the diaphragm layer. The support points are then cut through in order to remove the substrate.