The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Mar. 11, 2010
Chester Kuo, Taipei, TW;
Lung Hsin Chen, Hsinchu County, TW;
Wen Liang Tseng, Hsinchu, TW;
Shih Cheng Huang, Hsinchu, TW;
Po Min Tu, Chiayi County, TW;
Ying Chao Yeh, Taipei County, TW;
Wen Yu Lin, Taichung County, TW;
Peng Yi Wu, Taichung, TW;
Shih Hsiung Chan, Hsinchu County, TW;
Chester Kuo, Taipei, TW;
Lung Hsin Chen, Hsinchu County, TW;
Wen Liang Tseng, Hsinchu, TW;
Shih Cheng Huang, Hsinchu, TW;
Po Min Tu, Chiayi County, TW;
Ying Chao Yeh, Taipei County, TW;
Wen Yu Lin, Taichung County, TW;
Peng Yi Wu, Taichung, TW;
Shih Hsiung Chan, Hsinchu County, TW;
Advanced Optoelectronic Technology, Inc., Hsinchu Hsien, TW;
Abstract
A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.